AllI · HBM & memory bandwidthII · Advanced packaging & CoWoSIII · Lithography & EUV opticsIV · Leading-edge foundryV · Power, grid & generationVI · Liquid cooling & thermalVII · Optical interconnect & networkingVIII · Substrates, resist & wafer materialsIX · Accelerators & the capex layerX · Private giants & exposure vehicles
| Ticker | Name | Tier ↓ | Quote | Mkt cap | 1M | Chokepoints |
|---|---|---|---|---|---|---|
| ASML | ASML Holding N.V. | core | $1611.34+1.3% | $710.0B | -9.2% | lithography-euv · foundry-leading-edge |
| TSM | Taiwan Semiconductor Manufacturing Co. (ADR) | core | $431.59+1.7% | $1.9T | -4.9% | advanced-packaging · foundry-leading-edge |
| ZEISSSMT | Carl Zeiss SMT GmbH | core | private | — | via ASML | lithography-euv · foundry-leading-edge |
| INTC | Intel Corporation | watch | $93.55+3.4% | $600.0B | -20.0% | foundry-leading-edge |
| SSNLF | Samsung Electronics Co., Ltd. (unsponsored OTC ordinary) | watch | $65.21+0.0% | $1.5T | 0.0% | hbm-memory · foundry-leading-edge |
| SHECY | Shin-Etsu Chemical Co., Ltd. | speculative | $18.37-0.4% | $85.0B | +4.2% | foundry-leading-edge · substrates-materials |
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