AllI · HBM & memory bandwidthII · Advanced packaging & CoWoSIII · Lithography & EUV opticsIV · Leading-edge foundryV · Power, grid & generationVI · Liquid cooling & thermalVII · Optical interconnect & networkingVIII · Substrates, resist & wafer materialsIX · Accelerators & the capex layerX · Private giants & exposure vehicles
| Ticker | Name | Tier ↓ | Quote | Mkt cap | 6M | Chokepoints |
|---|---|---|---|---|---|---|
| MU | Micron Technology, Inc. | core | $924.35+2.3% | $1.1T | +70.5% | hbm-memory |
| BESIY | BE Semiconductor Industries N.V. (ADR) | watch | $179.16+9.7% | $26.0B | -39.1% | hbm-memory · advanced-packaging |
| CAMT | Camtek Ltd. | watch | $126.41+2.5% | $8.5B | -32.7% | hbm-memory · advanced-packaging |
| FORM | FormFactor, Inc. | watch | $105.69+4.5% | $11.0B | -23.2% | hbm-memory |
| ONTO | Onto Innovation Inc. | watch | $210.53+3.4% | $16.0B | -28.3% | hbm-memory · advanced-packaging |
| SSNLF | Samsung Electronics Co., Ltd. (unsponsored OTC ordinary) | watch | $65.21+0.0% | $1.5T | 0.0% | hbm-memory · foundry-leading-edge |
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