AllI · HBM & memory bandwidthII · Advanced packaging & CoWoSIII · Lithography & EUV opticsIV · Leading-edge foundryV · Power, grid & generationVI · Liquid cooling & thermalVII · Optical interconnect & networkingVIII · Substrates, resist & wafer materialsIX · Accelerators & the capex layerX · Private giants & exposure vehicles
| Ticker | Name | Tier ↓ | Quote | Mkt cap | 6M | Chokepoints |
|---|---|---|---|---|---|---|
| MU | Micron Technology, Inc. | core | $900.20-9.1% | $1.1T | +117.0% | hbm-memory |
| BESIY | BE Semiconductor Industries N.V. (ADR) | watch | $236.50-9.0% | $26.0B | +22.5% | hbm-memory · advanced-packaging |
| CAMT | Camtek Ltd. | watch | $151.46-2.4% | $8.5B | +3.4% | hbm-memory · advanced-packaging |
| FORM | FormFactor, Inc. | watch | $98.80-12.4% | $11.0B | +40.2% | hbm-memory |
| ONTO | Onto Innovation Inc. | watch | $262.33-9.9% | $16.0B | +29.8% | hbm-memory · advanced-packaging |
| SSNLF | Samsung Electronics Co., Ltd. (unsponsored OTC ordinary) | watch | $65.21+0.0% | $1.5T | 0.0% | hbm-memory · foundry-leading-edge |
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