AllI · HBM & memory bandwidthII · Advanced packaging & CoWoSIII · Lithography & EUV opticsIV · Leading-edge foundryV · Power, grid & generationVI · Liquid cooling & thermalVII · Optical interconnect & networkingVIII · Substrates, resist & wafer materialsIX · Accelerators & the capex layerX · Private giants & exposure vehicles
| Ticker | Name | Tier ↓ | Quote | Mkt cap | 6M | Chokepoints |
|---|---|---|---|---|---|---|
| AMKR | Amkor Technology, Inc. | core | $49.53-3.5% | $21.0B | +15.2% | advanced-packaging |
| TSM | Taiwan Semiconductor Manufacturing Co. (ADR) | core | $428.03-1.7% | $1.9T | +26.5% | advanced-packaging · foundry-leading-edge |
| ASX | ASE Technology Holding Co., Ltd. (ADR) | watch | $39.86-3.3% | $82.0B | +85.4% | advanced-packaging |
| BESIY | BE Semiconductor Industries N.V. (ADR) | watch | $212.25-3.3% | $26.0B | +0.0% | hbm-memory · advanced-packaging |
| CAMT | Camtek Ltd. | watch | $144.25-3.0% | $8.5B | -3.2% | hbm-memory · advanced-packaging |
| ONTO | Onto Innovation Inc. | watch | $268.92-3.4% | $16.0B | +41.9% | hbm-memory · advanced-packaging |
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