AllI · HBM & memory bandwidthII · Advanced packaging & CoWoSIII · Lithography & EUV opticsIV · Leading-edge foundryV · Power, grid & generationVI · Liquid cooling & thermalVII · Optical interconnect & networkingVIII · Substrates, resist & wafer materialsIX · Accelerators & the capex layerX · Private giants & exposure vehicles
| Ticker | Name | Tier ↓ | Quote | Mkt cap | 6M | Chokepoints |
|---|---|---|---|---|---|---|
| AMKR | Amkor Technology, Inc. | core | $38.52+4.6% | $21.0B | -46.1% | advanced-packaging |
| TSM | Taiwan Semiconductor Manufacturing Co. (ADR) | core | $430.73+1.5% | $1.9T | +8.3% | advanced-packaging · foundry-leading-edge |
| ASX | ASE Technology Holding Co., Ltd. (ADR) | watch | $40.77+2.2% | $82.0B | +29.1% | advanced-packaging |
| BESIY | BE Semiconductor Industries N.V. (ADR) | watch | $178.39+9.2% | $26.0B | -39.1% | hbm-memory · advanced-packaging |
| CAMT | Camtek Ltd. | watch | $125.62+1.9% | $8.5B | -32.7% | hbm-memory · advanced-packaging |
| ONTO | Onto Innovation Inc. | watch | $210.00+3.2% | $16.0B | -28.3% | hbm-memory · advanced-packaging |
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